We design embedded hardware that meets your performance, cost, and compliance targets — ready for certification and volume manufacturing from day one.
Every project starts with a thorough schematic capture that defines your system architecture — MCU/SoC selection, power tree, peripheral interfaces, and protection circuitry. We document every design decision for traceability and future maintenance.
Our PCB layouts range from compact 4-layer IoT modules to complex 8–16 layer industrial boards with controlled impedance, blind/buried vias, and high-density interconnect (HDI) technology. Every board undergoes full DRC and is reviewed against your manufacturer's fabrication capabilities before release.
We follow IPC standards throughout and deliver complete manufacturing packages: Gerber files, drill files, pick-and-place data, BOM, and assembly drawings.
Modern embedded systems demand careful attention to signal integrity. We handle high-speed interfaces — DDR3/DDR4 memory buses, USB 2.0/3.0, Gigabit Ethernet RGMII/RMII, and LVDS display links — with proper length matching, impedance control, and crosstalk mitigation.
Our power supply designs cover the full range from simple LDO-based single-rail systems to complex multi-rail architectures with sequencing requirements. We design efficient DC-DC converters, evaluate thermal performance under worst-case conditions, and validate power integrity across the entire operating envelope.
Every design includes comprehensive SPICE simulation of critical power and signal paths, ensuring first-spin success and reducing costly prototype iterations.
We select components with a dual focus: technical performance and supply chain resilience. Every BOM is built with second-source alternatives, long-term availability data, and cost optimization in mind. We actively monitor component lifecycle status and proactively flag end-of-life risks.
Design for Manufacturability (DFM) and Design for Assembly (DFA) principles are embedded in our workflow from the very first schematic revision. We consider SMT pad geometry, solder paste stencil design, reflow profile compatibility, and testpoint access to ensure your board can be manufactured at scale with high yield.
Thermal management is addressed early in the design cycle. We perform thermal simulation, specify appropriate copper pours, thermal vias, and heatsink solutions to keep junction temperatures within safe operating limits across your full ambient range.
Our hardware design team covers the full spectrum of embedded electronics.
Up to 16-layer designs with HDI, blind/buried vias, and rigid-flex substrates for space-constrained applications.
DDR3/4 memory, USB 2.0/3.0, Gigabit Ethernet, LVDS — with impedance control and length-matched routing.
DC-DC converters, LDO regulators, battery management, PoE, and isolated power supply architectures.
2.4/5 GHz Wi-Fi, BLE, LoRa, LTE/5G modem integration, and PCB antenna or u.FL connector solutions.
Thermal simulation, copper pour optimization, thermal via arrays, and heatsink specification for reliable operation.
Design for manufacturability checks, panelization, stencil design review, and testpoint placement for ICT/FCT.